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  rev.1.00 aug 10, 2005 page 1 of 8 HTT1127E silicon npn epitaxial twin transistor rej03g0839-0100 (previous ade-208-1540) rev.1.00 aug.10.2005 features ? include 2 transistors in a small size smd package: emfpak?6 (6 leads: 1.2 x 0.8 x 0.5 mm) q1: equivalent buffer transistor q2: equivalent osc transistor 2sc5700 2sc5849 outline renesas package code: pxsf0006la-a (package name: emfpak-6) 1. collector q1 2. emitter q1 3. collector q2 4. base q2 5. emitter q2 6. base q1 65 4 3 2 1 b1 e2 b2 c1 e1 c2 pin arrangement q1 q2 1 2 3 4 5 6 note: marking is ?r?.
HTT1127E rev.1.00 aug 10, 2005 page 2 of 8 absolute maximum ratings (ta = 25 c) ratings item symbol q1 q2 unit collector to base voltage v cbo 15 15 v collector to emitter voltage v ceo 4 6 v emitter to base voltage v ebo 1.5 1.5 v collector current i c 50 80 ma collector power dissipation p c total 200* mw junction temperature tj 150 150 c storage temperature tstg ?55 to + 150 ?50 to +150 c note: *value on pcb. (fr?4 (13 x 13 x 0.635 mm)). 0 50 100 150 200 collector power dissipation pc* (mw) collector power dissipation curve ambient temperature ta ( c) 250 200 150 100 50 *value on pcb. (fr?4 (13 x13 x 0.635 mm)) 2 devices total
HTT1127E rev.1.00 aug 10, 2005 page 3 of 8 q1 electrical characteristics (ta = 25 c) item symbol min typ max unit test conditions collector to base breakdown voltage v (br)cbo 15 ? ? v i c = 10 a, i e = 0 collector cutoff current i cbo ? ? 0.1 a v cb = 15 v, i e = 0 collector cutoff current i ceo ? ? 1.0 a v ce = 4 v, r be = infinite emitter cutoff current i ebo ? ? 0.1 a v eb = 0.8 v, i c = 0 dc current transfer ratio h fe 100 120 150 ? v ce = 1 v, i c = 5 ma reverse transfer capacitance c re ? 0.3 0.45 pf v cb = 1 v, f = 1 mhz emitter ground gain bandwidth product f t 10 12 ? ghz v ce = 1 v, i c = 5 ma, f = 1 ghz forward transfer coefficient |s 21 | 2 13 16 ? db noise figure nf ? 1.0 1.7 db v ce = 1 v, i c = 5 ma, f = 900 mhz, s = l = 50 ? q2 electrical characteristics (ta = 25 c) item symbol min typ max unit test conditions collector to base breakdown voltage v (br)cbo 15 ? ? v i c = 10 a, i e = 0 collector cutoff current i cbo ? ? 0.1 a v cb = 15 v, i e = 0 collector cutoff current i ceo ? ? 0.1 a v ce = 4 v, r be = infinite emitter cutoff current i ebo ? ? 0.1 a v eb = 1.5 v, i c = 0 dc current transfer ratio h fe 90 120 140 ? v ce = 1 v, i c = 5 ma reverse transfer capacitance c re ? 0.50 0.65 pf v cb = 1 v, f = 1 mhz emitter ground gain bandwidth product f t 2.0 4.0 ? ghz v ce = 1 v, i c = 5 ma, f = 1 ghz forward transfer coefficient |s 21 | 2 7 11 ? db noise figure nf ? 1.7 2.3 db v ce = 1 v, i c = 5 ma, f = 900 mhz s = l = 50 ?
HTT1127E rev.1.00 aug 10, 2005 page 4 of 8 q1 main characteristics 100 10 100 200 0 1 20 collector current i c (ma) dc current transfer ratio h fe dc current transfer ratio vs. collector current 25 50 v ce = 1 v 01234 typical output characteristics collector to emitter voltage v ce (v) collector current i c (ma) 20 30 40 50 10 0 0.4 0.6 1.0 typical forward transfer characteristics base to emitter voltage v be (v) 0.2 0.8 v ce = 1 v collector current i c (ma) 10 20 30 40 50 i b = 50 a 100 a 150 a 200 a 250 a 300 a 350 a 400 a 450 a 500 a collector to base voltage v cb (v) reverse transfer capacitance c re (pf) reverse transfer capacitance vs. collector to base voltage 0.4 0.3 0.2 0.1 0 0.2 0.4 0.6 1.0 emitter ground f = 1 mhz 0.5 0.8 20 16 12 8 4 0 1 2 5 10 20 50 100 collector current i c (ma) gain bandwidth product f t (ghz) gain bandwidth product vs. collector current f = 1 ghz v ce = 2 v collector current i c (ma) noise figure nf (db) noise figure vs. collector current 6 4 3 2 1 0 1 2 5 10 20 50 100 5 v ce = 1 v f = 900 mhz v ce = 1 v v ce = 2 v v ce = 1 v
HTT1127E rev.1.00 aug 10, 2005 page 5 of 8 20 16 12 8 4 0 12 51020 50100 collector current i c (ma) s 21 parameter |s 21 | 2 (db) s 21 parameter vs. collector current f = 900 mhz v ce = 1 v v ce = 2 v
HTT1127E rev.1.00 aug 10, 2005 page 6 of 8 q2 main characteristics 20 16 12 8 4 123456 25 20 15 10 5 0 0.2 0.4 0.6 0.8 1.0 200 100 0 0.1 1.0 10 100 i b = 20 a 40 a 60 a 80 a 100 a 120 a 140 a 160 a v ce = 1 v v ce = 1 v 0 180 a typical output characteristics collector current i c (ma) collector to emitter voltage v ce (v) typical forward transfer characteristics collector current i c (ma) base to emitter voltage v be (v) dc current transfer ratio h fe dc current transfer ratio vs. collector current collector current i c (ma) collector to base voltage v cb (v) reverse transfer capacitance c re (pf) reverse transfer capacitance vs. collector to base voltage 0.8 0.6 0.4 0.2 0 0.2 0.4 0.6 1.0 emitter ground f = 1 mhz 1.0 0.8 6 4 3 2 1 0 12 51020 50100 collector current i c (ma) noise figure nf (db) noise figure vs. collector current 5 v ce = 1 v f = 900 mhz v ce = 1 v v ce = 2 v 10 6 12 8 4 0 12 51020 50100 collector current i c (ma) gain bandwidth product f t (ghz) gain bandwidth product vs. collector current f = 1 ghz v ce = 2 v v ce = 1 v 2
HTT1127E rev.1.00 aug 10, 2005 page 7 of 8 20 16 12 8 4 0 12 51020 50100 collector current i c (ma) s 21 parameter |s 21 | 2 (db) s 21 parameter vs. collector current f = 900 mhz v ce = 1 v v ce = 2 v
HTT1127E rev.1.00 aug 10, 2005 page 8 of 8 package dimensions e c a l a e b h e l p a 2 i 1 b 2 a a 1 d a xsa m s ys b a-a section b 1 c 1 c e 1 e pattern of terminal position areas a a 1 a 2 b b 1 c c 1 d e e h e l l p x y b 2 e 1 i 1 0.45 0 0.45 0.1 0.1 1.15 0.75 0.95 0.05 0.1 min nom dimension in millimeters reference symbol max 0.17 0.15 0.13 0.11 1.2 0.8 0.4 1.0 0.1 0.7 0.5 0.01 0.49 0.25 0.15 1.25 0.85 1.05 0.15 0.3 0.05 0.05 0.3 0.35 ? 0.0012g mass[typ.] emfpak-6 / emfpak-6v pxsf0006la-a renesas code jeita package code package name ordering information part name quantity shipping container HTT1127Ertl-e 5000 178 mm reel, 8 mm emboss taping note: for some grades, production may be terminated. please contact the renesas sales office to check the state of production before ordering the product.
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is a lways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placeme nt of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies o r errors. please also pay attention to information published by renesas technology corp. by various means, including the renesas techn ology corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under ci rcumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materi als. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com refer to " http://www.renesas.com/en/network " for the latest and detailed information. renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500, fax: <1> (408) 382-7501 renesas technology europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k. tel: <44> (1628) 585-100, fax: <44> (1628) 585-900 renesas technology hong kong ltd. 7th floor, north tower, world finance centre, harbour city, 1 canton road, tsimshatsui, kowloon, hong kong tel: <852> 2265-6688, fax: <852> 2730-6071 renesas technology taiwan co., ltd. 10th floor, no.99, fushing north road, taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology (shanghai) co., ltd. unit2607 ruijing building, no.205 maoming road (s), shanghai 200020, china tel: <86> (21) 6472-1001, fax: <86> (21) 6415-2952 renesas technology singapore pte. ltd. 1 harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas technology korea co., ltd. kukje center bldg. 18th fl., 191, 2-ka, hangang-ro, yongsan-ku, seoul 140-702, korea tel: <82> 2-796-3115, fax: <82> 2-796-2145 renesas technology malaysia sdn. bhd. unit 906, block b, menara amcorp, amcorp trade centre, no.18, jalan persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: <603> 7955-9390, fax: <603> 7955-9510 renesas sales offices ? 200 5. re nesas technology corp ., all rights reser v ed. printed in ja pan. colophon .3.0


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